Total 478
   
ECWC 14 DAY 3-2
Writer : KPCA Date : 2017-09-05 09:35








 

ECWC 14 DAY 3-2

o Date: April 27, 2017 13:00~14:30

o Venue: KINTEX, Seoul

S16 Packaging Technology

CARL CHIANG, TPCA

  S17 Testing/Reliability 3

Chair: Tim Lee, KPCA

   S18 Soldering

Kevin Yan, CPCA

13:00~13:30

PKO-1 Strong Effect of Plating

Current Density on the Cu Pillar

Microstructure and Its Adhesion

with An ABF Substrate
YingSyuan Wu, Yuan Ze University

RLO-31 Evaluation of the Anti-Creep Corrosion Capacity for ENIG PCB by Way of Accelerated Corrosion Verification Platform
Dem Lee, IST

ST0-1 Solderability between

Sn-3Ag-0.5Cu Alloy and

Cu Pillars Deposited via Different Plating Current Densities
PeiTzu Lee, Yuan Ze University

13:30~14:00

PKO-2  Controlling the Adhesion of Electroless Plating Ni-P Film on Si Wafer by Silane Compound Modification and Rapid Thermal Annealing

Wei-Yen Wang, National Tsing Hua University

RLO-32 Flexibility Test Method for Optic-Electric FPCB

Young-Min Im, Korea Electronics Technology Institute

STO-2 Solder Wetting Behavior of Plasma Organic Surface Finish with Multiple Heat-Treatment
Kyoung-Ho Kim, Korea Institute of Industrial Technology

14:00~14:30

PKO-3 Study on A Formulated No Clean Flux For Fine-Pitch Flip Chip Package of Copper Pillar/

Microbump Interconnect
Ya-Ching Chuang, Shenmao Technology Inc.

STO-3 Interfacial Microstructures of Solder Joints on ENIG and ENEPIG Surface Finishes with Metal Turnover of Ni Plating Solution
Wonil Seo, Korea Institute of Industrial Technology



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    Total : 478
Page 1/32
No. Subject Writer Date
 < IEC TC 91 WG 5 Meeting > KPCA 18-06-19
 < IEC TC 91 WG 4 Meeting > KPCA 18-06-19
 < IEC TC 91 WG 6 Meeting > KPCA 18-06-19
 < IEC TC 91 WG 3 Meeting > KPCA 18-06-19
 < IEC TC 91 WG 10 Meeting > KPCA 18-06-19
 IPC D-13 (Flexible Circuits Base Materials) Meeting KPCA 18-06-19
 IPC D-12 (Flexible Circuits Specifications) Meeting KPCA 18-06-19
 IPC D-15 (Flexible Circuits Test Methods) Meeting KPCA 18-06-19
 IPC D-55 (Embedded Devices Process) Meeting KPCA 18-06-19
 IPC 2-30 (Terms and Definitions) Meeting KPCA 18-06-19
 IPC 3-11 (Laminate/Prepreg) Meeting KPCA 18-06-19
 IEC TC 91 WG 10 Meeting KPCA 18-06-14
 IEC TC 91 WG 5 Meeting KPCA 18-06-14
 IEC TC 91 WG 4 Meeting KPCA 18-06-14
 IEC TC 91 WG 6 Meeting KPCA 18-06-14
 IEC TC91 WG 3 meeting KPCA 18-06-14
 IEC TC91 Plenary Meeting KPCA 18-06-14
 IPCAshow2017 Opening Ceremony KPCA 17-09-05
 JPCAshow 2017 WECC lunch - WECC Flag handover ceremony KPCA 17-09-05
 JPCAshow2017 Opening Ceremony KPCA 17-09-05
 KPCAshow2017 Opening Ceremony KPCA 17-09-05
 KPCAshow 2017 WECC Welcome Meeting KPCA 17-09-05
 ECWC 14 DAY 3-2 KPCA 17-09-05
 ECWC 14 DAY 3-1 KPCA 17-09-05
 ECWC 14 DAY 2-3 KPCA 17-09-05
 ECWC 14 DAY 2-2 KPCA 17-09-05
 ECWC 14 DAY 2-1 KPCA 17-09-05
 ECWC 14 DAY 1 KPCA 17-09-05
 The 15th Plenary meeting KPCA 17-09-05
 CPCAshow2017 Opening Ceremony and Reception KPCA 17-09-05
 The 34th Board Meeting KPCA 17-09-05
478  < IEC TC 91 WG 4 Meeting > KPCA 18-06-19
477  < IEC TC 91 WG 5 Meeting > KPCA 18-06-19
476  < IEC TC 91 WG 6 Meeting > KPCA 18-06-19
475  < IEC TC 91 WG 3 Meeting > KPCA 18-06-19
474  < IEC TC 91 WG 10 Meeting > KPCA 18-06-19
473  IPC D-13 (Flexible Circuits Base Materials) Meeting KPCA 18-06-19
472  IPC D-12 (Flexible Circuits Specifications) Meeting KPCA 18-06-19
471  IPC D-15 (Flexible Circuits Test Methods) Meeting KPCA 18-06-19
470  IPC D-55 (Embedded Devices Process) Meeting KPCA 18-06-19
469  IPC 2-30 (Terms and Definitions) Meeting KPCA 18-06-19
468  IPC 3-11 (Laminate/Prepreg) Meeting KPCA 18-06-19
467  IEC TC 91 WG 10 Meeting KPCA 18-06-14
466  IEC TC 91 WG 6 Meeting KPCA 18-06-14
465  IEC TC 91 WG 5 Meeting KPCA 18-06-14
464  IEC TC 91 WG 4 Meeting KPCA 18-06-14
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