Total 478
   
ECWC 14 DAY 2-1
Writer : KPCA Date : 2017-09-05 09:29










ECWC 14 DAY 2-1

o Date: April 26, 2017 10:00~12:00

o Venue: KINTEX, Seoul

Room 305

Room 306

Room 307

S6 Packaging/PCB Materials 2

Chair: CHUN-LAI, CHANG,

Dupont Taiwan Limited

 S7 Processing Technology 2

Chair: David Bergman, IPC

  S8 Embedding Technology

Chair: Alun Morgan, EIPC

10:00~10:30

MAO-21  Feasibility Studies and Development of High

Reliability Photosensitive Solder Resist for IC Package
Tomoya Kudo, Taiyo Ink Mfg. Co., Ltd.

PTO-21 An overview of Registration for Multilayer

Printed Circuit Boards
Paul Walder, MIE Multiline International Europa L.P

EBO-1 Sharing experience in Embedding of Active and Passive Components in Organic PCBs for more  reliability and miniaturization.
Thomas Hofmann, Hofmann Leiterplatten GmbH

10:30~11:00

MAO-22 Advance Research on Resin of Liquid Photosensitive Solder White Ink
Yanhua Yuan,
Jiangsu Kuangshun

PTO-22 Technology of Partial Hybrid Dielectric in Same Layer
Ping Zeng, Shenzhen Kinwong Electronic Co., Ltd.

EBO-2 Automotive camera module using passive device embedded substrate
Hyunho Kim, KAIST

11:00~11:30

MAO-23  UV/LED Light initiator and Photoresist curing research
Yanhua Yuan, Jiangsu Kuangshun

PTO-23 Thin substrate development trend in industry

Brandon Kim, K-Sol

EBO-3  Analysis of power module based on embedded  component technology
Lixiang Huang, Shennan Circuits Co., Ltd.



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    Total : 478
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No. Subject Writer Date
 < IEC TC 91 WG 5 Meeting > KPCA 18-06-19
 < IEC TC 91 WG 4 Meeting > KPCA 18-06-19
 < IEC TC 91 WG 6 Meeting > KPCA 18-06-19
 < IEC TC 91 WG 3 Meeting > KPCA 18-06-19
 < IEC TC 91 WG 10 Meeting > KPCA 18-06-19
 IPC D-13 (Flexible Circuits Base Materials) Meeting KPCA 18-06-19
 IPC D-12 (Flexible Circuits Specifications) Meeting KPCA 18-06-19
 IPC D-15 (Flexible Circuits Test Methods) Meeting KPCA 18-06-19
 IPC D-55 (Embedded Devices Process) Meeting KPCA 18-06-19
 IPC 2-30 (Terms and Definitions) Meeting KPCA 18-06-19
 IPC 3-11 (Laminate/Prepreg) Meeting KPCA 18-06-19
 IEC TC 91 WG 10 Meeting KPCA 18-06-14
 IEC TC 91 WG 5 Meeting KPCA 18-06-14
 IEC TC 91 WG 4 Meeting KPCA 18-06-14
 IEC TC 91 WG 6 Meeting KPCA 18-06-14
 IEC TC91 WG 3 meeting KPCA 18-06-14
 IEC TC91 Plenary Meeting KPCA 18-06-14
 IPCAshow2017 Opening Ceremony KPCA 17-09-05
 JPCAshow 2017 WECC lunch - WECC Flag handover ceremony KPCA 17-09-05
 JPCAshow2017 Opening Ceremony KPCA 17-09-05
 KPCAshow2017 Opening Ceremony KPCA 17-09-05
 KPCAshow 2017 WECC Welcome Meeting KPCA 17-09-05
 ECWC 14 DAY 3-2 KPCA 17-09-05
 ECWC 14 DAY 3-1 KPCA 17-09-05
 ECWC 14 DAY 2-3 KPCA 17-09-05
 ECWC 14 DAY 2-2 KPCA 17-09-05
 ECWC 14 DAY 2-1 KPCA 17-09-05
 ECWC 14 DAY 1 KPCA 17-09-05
 The 15th Plenary meeting KPCA 17-09-05
 CPCAshow2017 Opening Ceremony and Reception KPCA 17-09-05
 The 34th Board Meeting KPCA 17-09-05
478  < IEC TC 91 WG 4 Meeting > KPCA 18-06-19
477  < IEC TC 91 WG 5 Meeting > KPCA 18-06-19
476  < IEC TC 91 WG 6 Meeting > KPCA 18-06-19
475  < IEC TC 91 WG 3 Meeting > KPCA 18-06-19
474  < IEC TC 91 WG 10 Meeting > KPCA 18-06-19
473  IPC D-13 (Flexible Circuits Base Materials) Meeting KPCA 18-06-19
472  IPC D-12 (Flexible Circuits Specifications) Meeting KPCA 18-06-19
471  IPC D-15 (Flexible Circuits Test Methods) Meeting KPCA 18-06-19
470  IPC D-55 (Embedded Devices Process) Meeting KPCA 18-06-19
469  IPC 2-30 (Terms and Definitions) Meeting KPCA 18-06-19
468  IPC 3-11 (Laminate/Prepreg) Meeting KPCA 18-06-19
467  IEC TC 91 WG 10 Meeting KPCA 18-06-14
466  IEC TC 91 WG 6 Meeting KPCA 18-06-14
465  IEC TC 91 WG 5 Meeting KPCA 18-06-14
464  IEC TC 91 WG 4 Meeting KPCA 18-06-14
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