Total 478
   
ECWC 14 DAY 1
Writer : KPCA Date : 2017-09-05 09:26













ECWC 14 DAY 1

o Date: April 25, 2017 10:00~17:00

o Venue: KINTEX, Seoul

11:00~11:10

 Opening Ceremony

11:10~12:10

 Keynotes

Packaging Technology in 2017 and Beyond

YoungChul Park, Amkor Technology Korea

Global Electronic Industry Supply Chain: Present & Future Market Dynamics

Walter Custer, Custer Consulting Group

Lunch/Poster Session (12:10~13:00)

 

Room 305

Room 306

Room 307

S1 Packaging/PCB Materials 1

Chair: CARL CHIANG, TPCA

  S2 Processing Technology 1

Chair: Chris Jorgenson, IPC

Short Course (13:00~15:30)

13:00~13:30

MAO-11 Development of adhesive fluorocarbon film and powder for high frequency and high speed PCB base materials
Wataru Kasai, Asahi Glass Co., Ltd.

PTO-11 New, advanced soldermask and photoresist pretreatment for significant waste water benefits and low etch depth requirement
Wonjin Cho, Atotech (China) Chemicals Ltd

Fan-Out Wafer-Level

Packaging and

3D Packaging
 John Lau,

ASM Pacific Technology

13:30~14:00

MAO-12 Ultra-Low Dk PCB Materials for High Speed Low loss applications

Martin Cotton, Ventec International Group

PTO-12 Research on Process of Special Inlay Design
Lu Xiao, Shengyi Electronic Co., Ltd.

14:00~14:30

MAO-13 Novel low loss multilayer material for High speed application

Jeongdon Kwon, Doosan Corp. Electro-Materials BG

PTO-13 Copper Electroplating of a Printed Circuit Board Using Reduced Graphene Oxide as a Conducting Layers
WeiYang Zeng, National Chung Hsing University

14:30~15:00

MAO-14 R & D of a Novel Environment-friendly Copper Clad Laminate, which is decomposable and recyclable

Xingdi Jie, Shengyi Technology Co., Ltd.

PTO-14. The production and application research of a special high-precision entry board used in back-drilling
Xiaoyang Luo, Shenzhen Newccess Industrial Co., Ltd

 Break/Poster Session (15:00~15:30)

 

 S3 Management

Chair: Alun Morgan, EIPC

 S4 Testing/Reliability 1

Chair: Kevin Yan, CPCA

 S5 High Speed PCB

Chair: Chris Jorgenson, IPC

15:30~16:00

MGO-1 Best Practices to Aid Enterprise Supply Chain Data Collection Challenges

Rosalie Castillo, WSP|Parsons

Brinckerhoff

RLO-11 The application of HPLC in the process of manufacturing process of copper clad laminate
Dan Li, Shengyi Technology Co., Ltd.

 

16:00~16:30

MGO-2 Preventing Corrosion of Electronic Components by Supply Chain Management

Seung Jae Baek, CentroChemCompany

RLO-12 Characterization of Solder Spreading Effect by Thermal Treatment for Immersion Tin Plating of PCB
Jongkwan Jang, Hwabaek Engineering Co. Ltd.

HSO-1 Influence of Copper Conductor Surface Treatment for High Frequency PCB on Electrical Properties and Reliability.
Seiya Kido, MEC Company

16:30~17:00

 

MGO-3 Conflict Minerals: The Real Meaning of Due Diligence and the Advocacy

Teresa Visto, WSP|Parsons Brinckerhoff

RLO-13 Quality factor of a printed circuit board affects the SMT-With emphasis on the automotive PCB

Heekyung Kim, Moriah Korea

HSO-2 The study of Microstripline Impedance
Lijuan Hou, Kinwong Electronic (Shenzhen) Co., Ltd.



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    Total : 478
Page 1/32
No. Subject Writer Date
 < IEC TC 91 WG 5 Meeting > KPCA 18-06-19
 < IEC TC 91 WG 4 Meeting > KPCA 18-06-19
 < IEC TC 91 WG 6 Meeting > KPCA 18-06-19
 < IEC TC 91 WG 3 Meeting > KPCA 18-06-19
 < IEC TC 91 WG 10 Meeting > KPCA 18-06-19
 IPC D-13 (Flexible Circuits Base Materials) Meeting KPCA 18-06-19
 IPC D-12 (Flexible Circuits Specifications) Meeting KPCA 18-06-19
 IPC D-15 (Flexible Circuits Test Methods) Meeting KPCA 18-06-19
 IPC D-55 (Embedded Devices Process) Meeting KPCA 18-06-19
 IPC 2-30 (Terms and Definitions) Meeting KPCA 18-06-19
 IPC 3-11 (Laminate/Prepreg) Meeting KPCA 18-06-19
 IEC TC 91 WG 10 Meeting KPCA 18-06-14
 IEC TC 91 WG 5 Meeting KPCA 18-06-14
 IEC TC 91 WG 4 Meeting KPCA 18-06-14
 IEC TC 91 WG 6 Meeting KPCA 18-06-14
 IEC TC91 WG 3 meeting KPCA 18-06-14
 IEC TC91 Plenary Meeting KPCA 18-06-14
 IPCAshow2017 Opening Ceremony KPCA 17-09-05
 JPCAshow 2017 WECC lunch - WECC Flag handover ceremony KPCA 17-09-05
 JPCAshow2017 Opening Ceremony KPCA 17-09-05
 KPCAshow2017 Opening Ceremony KPCA 17-09-05
 KPCAshow 2017 WECC Welcome Meeting KPCA 17-09-05
 ECWC 14 DAY 3-2 KPCA 17-09-05
 ECWC 14 DAY 3-1 KPCA 17-09-05
 ECWC 14 DAY 2-3 KPCA 17-09-05
 ECWC 14 DAY 2-2 KPCA 17-09-05
 ECWC 14 DAY 2-1 KPCA 17-09-05
 ECWC 14 DAY 1 KPCA 17-09-05
 The 15th Plenary meeting KPCA 17-09-05
 CPCAshow2017 Opening Ceremony and Reception KPCA 17-09-05
 The 34th Board Meeting KPCA 17-09-05
478  < IEC TC 91 WG 4 Meeting > KPCA 18-06-19
477  < IEC TC 91 WG 5 Meeting > KPCA 18-06-19
476  < IEC TC 91 WG 6 Meeting > KPCA 18-06-19
475  < IEC TC 91 WG 3 Meeting > KPCA 18-06-19
474  < IEC TC 91 WG 10 Meeting > KPCA 18-06-19
473  IPC D-13 (Flexible Circuits Base Materials) Meeting KPCA 18-06-19
472  IPC D-12 (Flexible Circuits Specifications) Meeting KPCA 18-06-19
471  IPC D-15 (Flexible Circuits Test Methods) Meeting KPCA 18-06-19
470  IPC D-55 (Embedded Devices Process) Meeting KPCA 18-06-19
469  IPC 2-30 (Terms and Definitions) Meeting KPCA 18-06-19
468  IPC 3-11 (Laminate/Prepreg) Meeting KPCA 18-06-19
467  IEC TC 91 WG 10 Meeting KPCA 18-06-14
466  IEC TC 91 WG 6 Meeting KPCA 18-06-14
465  IEC TC 91 WG 5 Meeting KPCA 18-06-14
464  IEC TC 91 WG 4 Meeting KPCA 18-06-14
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